Ceramic PCB
The Ceramic PCB products are combined with the excellent heat dissipation performance of industrial ceramic and the characteristics of the metal conductor. The ceramic substrate and the metal film sintered into integrated circuit by using the technology of precision automation printing or vacuum coating on the high precision ceramic substrate.
Feature:
Stable input and output ;
High precision and low TCR;
Good heat dissipation performance;
Free of harmful substance and eco-friendly.
Application:
Communication base station circuit board
LED ceramic heat dissipation power module;
Ozone generator , vehicle sensor, solid-state relay ;
High -precision monolayer and multilayer circuit board;
Space industry and new energy industry core components.
Al2O3 Ceramic Circuit Technical Standard
| Test Items | Technical Parameters | Test Conditions |
| Size and tolerance | Keep in conformity with the technical drawing | Microscope |
| Warping degree | 1.Conectar≤0.2% 2. Monolithic≤0.05mm | Warping admeasuring tool |
Appearance Inspection
| Defect Characteristics | Criteria | Test Conditions |
| Fracture, stratification, scars and thru hole | Not allowed | Visual |
| Salient point, silver layer falls off, bumps, impurity | Product area≤0.2mm,Cross area≤ 0.1mm,other area≤0.3mm | 10 x microscope |
| Discolor | Silver Layer discolor: not allowed, ceramic substrates: light yellow allowed | Visual |
| Pollution | Not allowed | Visual |
| Short-circuit between conductor | Line distance >0.15mm | Microscope |
Printing Layer/Coating Performance:
| Test Items | Technical Parameters | Test Conditions |
| Printing layer/Coating graphic | Keep in conformity with the product drawing | 10 x microscope |
| Drying-out resistance | Keep in conformity with the product drawing | Heating on heating board 300ºC/5min |
| Solder invasive | Invasive area≥95% | 260±5ºC/5±1 Sec immersion tin |
| Soldering resistance | Unilateral adhered tin 75μm | 260±5ºC/10±1 Sec immersion tin |
| Tension | Printing layer >20gf | Welding plate crossed φ130μm Cu |
| Adhesion | Not stripping | Tape cling to the surface with 3M#600, speed tear in the direction 90ºC after 30sec |
Electrical Performance :
| Test Items | Criteria | Test Conditions |
| Short circuit | Not allowed | Switch Testers |
| Open circuit | Not allowed | Switch Testers |
| Test Items | Technical Parameters | Test Conditions |
| Red ink test | Not penetration | Red ink boiling 100ºC/1Hr |
| Thermal shock test | Good tightness and stratified, fall off and electrical performance is normal | 1.Temperature:-55ºC/125ºC 2.min/2min 3.Switching time Max10s 4.times:15 |